View R5F212F4DXXXFP_2583017.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

rev.0.10 aug 01, 2007 page 1 of 39 rej03b0222-0010 r8c/2e group, r8c/2f group renesas mcu 1. overview 1.1 features the r8c/2e group and r8c/2f group of single-chip mcus incorporates the r8c/tiny series cpu core, employing sophisticated instructions for a high level of efficiency. with 1 mbyte of address space and is capable of executing instructions at high speed. in addition, the cpu core boasts a multiplier for high-speed operation processing. power consumption is low, and the supported operating modes allow additional power control. these mcus also use an anti-noise configuration to reduce emissions of electro magnetic noise and are designed to withstand emi. integration of many peripheral functions, including multifun ction timer and serial inte rface, reduces the number of system components. furthermore, the r8c/2f group has on-chip data flash (1 kb 2 blocks). the difference between the r8c/2e group and r8c/2f group is only the presence or absence of data flash. their peripheral functions are the same. 1.1.1 applications electronic household appliances, office equipment, audio equipment, cons umer equipment, etc. rej03b0222-0010 rev.0.10 aug 01, 2007 preliminary notice: this is not a final specification. some parametric limits are subject to change.
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 2 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change 1.1.2 specifications tables 1.1 and 1.2 outlines the specifications fo r r8c/2e group and tables 1.3 and 1.4 outlines the specifications for r8c/2f group table 1.1 specifications for r8c/2e group (1) item function specification cpu central processing unit r8c/tiny series core ? number of fundamental instructions: 89 ? minimum instruction execution time: 50 ns (f(xin) = 20 mhz, vcc = 3.0 to 5.5 v) 100 ns (f(xin) = 10 mhz, vcc = 2.7 to 5.5 v) ? multiplier: 16 bits 16 bits 32 bits ? multiply-accumulate instruction: 16 bits 16 bits + 32 bits 32 bits ? operation mode: single-chip mode (address space: 1 mbyte) memory rom, ram refer to table 1.5 product list for r8c/2e group . power supply voltage detection voltage detection circuit ? power-on reset ? voltage detection 2 i/o ports programmable i/o ports ? input-only: 3 pins ? cmos i/o ports: 25, selectable pull-up resistor ? high current drive ports: 8 clock clock generation circuits 2 circuits: xin clock oscillation circ uit (with on-chip feedback resistor), on-chip oscillator (hi gh-speed, lo w-speed) (high-speed on-chip oscillator has a fre quency adjustment function) ? oscillation stop detection: xin clock oscillation stop detection function ? frequency divider circuit: dividing selectable 1, 2, 4, 8, and 16 ? low power consumption modes: standard operating mode (high-s peed clock, high-speed on-chip oscillator, low-speed on-chip o scillator), wait mode, stop mode interrupts ? external: 4 sources, internal: 15 sources, software: 4 sources ? priority levels: 7 levels watchdog timer 15 bits 1 (with prescaler), reset start selectable timer timer ra 8 bits 1 (with 8-bit prescaler) timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode timer rb 8 bits 1 (with 8-bit prescaler) timer mode (period timer), programmable waveform generation mode (pwm output), programmable one-shot generation mode, programmable wait one-shot generation mode timer rc 16 bits 1 (with 4 capture/compare registers) timer mode (input capture function, output compare function), pwm mode (output 3 pins), pwm2 mode (pwm output pin) timer re 8 bits 1 output compare mode serial interface uart0 clock synchronous serial i/o/uart 1 lin module hardware lin: 1 (timer ra, uart0) a/d converter 10-bit resolution 12 channels, includes sample and hold function d/a converter 8-bit resolution 2 circuits comparator 2 circuits
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 3 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change note: 1. specify the d version if d version functions are to be used. table 1.2 specifications for r8c/2e group (2) item specification flash memory ? programming and erasure voltage: vcc = 2.7 to 5.5 v ? programming and erasure endurance: 100 times ? program security: rom code protect, id code check ? debug functions: on-chip debug, on-board flash rewrite function operating frequency/supply voltage f(xin) = 20 mhz (vcc = 3.0 to 5.5 v), f(xin) = 10 mhz (vcc = 2.7 to 5.5 v) current consumption typ. 10 ma (vcc = 5.0 v, f(xin) = 20 mhz) typ. 6 ma (vcc = 3.0 v, f(xin) = 10 mhz) typ. 23 a (vcc = 3.0 v, wait mode (peripheral clock off)) typ. 0.7 a (vcc = 3.0 v, stop mode) operating ambient temperature -20 to 85 c (n version) -40 to 85 c (d version) (1) package 32-pin lqfp package code: plqp0032gb-a (previous code: 32p6u-a)
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 4 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change table 1.3 specifications for r8c/2f group (1) item function specification cpu central processing unit r8c/tiny series core ? number of fundamental instructions: 89 ? minimum instruction execution time: 50 ns (f(xin) = 20 mhz, vcc = 3.0 to 5.5 v) 100 ns (f(xin) = 10 mhz, vcc = 2.7 to 5.5 v) ? multiplier: 16 bits 16 bits 32 bits ? multiply-accumulate instruction: 16 bits 16 bits + 32 bits 32 bits ? operation mode: single-chip mode (address space: 1 mbyte) memory rom, ram refer to table 1.6 product list for r8c/2f group . power supply voltage detection voltage detection circuit ? power-on reset ? voltage detection 2 i/o ports programmable i/o ports ? input-only: 3 pins ? cmos i/o ports: 25, sele ctable pull-up resistor ? high current drive ports: 8 clock clock generation circuits 2 circuits: xin clock oscillation circ uit (with on-chip fe edback resistor), on-chip oscillator (high-speed, low-speed) (high-speed on-chip oscillator has a frequency adjustment function) ? oscillation stop detection: xin clock oscillation stop detection function ? frequency divider circuit: dividing selectable 1, 2, 4, 8, and 16 ? low power consumption modes: standard operating mode (high-speed clock, high-speed on-chip oscillator, low-speed on-chip os cillator), wait mode, stop mode interrupts ? external: 4 sources, intern al: 15 sources, software: 4 sources ? priority levels: 7 levels watchdog timer 15 bits 1 (with prescaler), reset start selectable timer timer ra 8 bits 1 (with 8-bit prescaler) timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode timer rb 8 bits 1 (with 8-bit prescaler) timer mode (period timer), programmable waveform generation mode (pwm output), programmable one-shot generation mode, programmable wait one-shot generation mode timer rc 16 bits 1 (with 4 capture/compare registers) timer mode (input capture function, output compare function), pwm mode (output 3 pins), pwm2 mode (pwm output pin) timer re 8 bits 1 output compare mode serial interface uart0 clock synchronous serial i/o/uart 1 lin module hardware lin: 1 (timer ra, uart0) a/d converter 10-bit resolution 12 channels, includes sample and hold function d/a converter 8-bit resolution 2 circuits comparator 2 circuits
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 5 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change note: 1. specify the d version if d version functions are to be used. table 1.4 specifications for r8c/2f group (2) item specification flash memory ? programming and erasure voltage: vcc = 2.7 to 5.5 v ? programming and erasure endurance: 10,000 times (data flash) 1,000 times (program rom) ? program security: rom code protect, id code check ? debug functions: on-chip debug, on-board flash rewrite function operating frequency/supply voltage f(xin) = 20 mhz (vcc = 3.0 to 5.5 v), f(xin) = 10 mhz (vcc = 2.7 to 5.5 v) current consumption typ. 10 ma (vcc = 5.0 v, f(xin) = 20 mhz) typ. 6 ma (vcc = 3.0 v, f(xin) = 10 mhz) typ. 23 a (vcc = 3.0 v, wait mode (peripheral clock off)) typ. 0.7 a (vcc = 3.0 v, stop mode) operating ambient temperature -20 to 85 c (n version) -40 to 85 c (d version) (1) package 32-pin lqfp package code: plqp0032gb-a (previous code: 32p6u-a)
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 6 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change 1.2 product list table 1.5 lists product list for r8c/2e group, figure 1.1 shows a part number, memory size, and package of r8c/2e group, table 1.6 lists product list for r8c/2f group, and figure 1.2 shows a part number, memory size, and package of r8c/2f group. (d): under development note: 1. the user rom is programmed before shipment. figure 1.1 part number, memory size, and package of r8c/2e group table 1.5 product list for r8c/2e group current of aug. 2007 part no. rom capacity ram ca pacity package type remarks r5f212e2nfp (d) 8 kbytes 512 bytes plqp0032gb-a n version r5f212e4nfp (d) 16 kbyt es 1 kbyte plqp0032gb-a r5f212e2dfp (d) 8 kbytes 512 bytes plqp0032gb-a d version r5f212e4dfp (d) 16 kbyt es 1 kbyte plqp0032gb-a r5f212e2nxxxfp (d) 8 kbytes 512 bytes plqp0032gb-a n version factory programming product (1) r5f212e4nxxxfp (d) 16 kb ytes 1 kbyte plqp0032gb-a r5f212e2dxxxfp (d) 8 kbytes 512 bytes plqp0032gb-a d version factory programming product (1) r5f212e4dxxxfp (d) 16 kb ytes 1 kbyte plqp0032gb-a part no. r 5 f 21 2e 2 n xxx fp package type: fp: plqp0032gb-a rom number (only factory programming product) classification n: operating ambient temperature -20c to 85c d: operating ambient temperature -40c to 85c rom capacity 2: 8 kb 4: 16 kb r8c/2e group r8c/tiny series memory type f: flash memory version renesas mcu renesas semiconductor
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 7 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change (d): under development note: 1. the user rom is programmed before shipment. figure 1.2 part number, memory size, and package of r8c/2f group table 1.6 product list for r8c/2f group current of aug. 2007 part no. rom capacity ram capacity package type remarks program rom data flash r5f212f2nfp (d) 8 kbytes 1 kbyte 2 512 bytes plqp0032gb-a n version r5f212f4nfp (d) 16 kbytes 1 kbyte 2 1 kbyte plqp0032gb-a r5f212f2dfp (d) 8 kbytes 1 kbyte 2 512 bytes plqp0032gb-a d version r5f212f4dfp (d) 16 kbytes 1 kbyte 2 1 kbyte plqp0032gb-a r5f212f2nxxxfp (d) 8 kbytes 1 kbyte 2 512 bytes plqp0032gb-a n version factory programming product (1) r5f212f4nxxxfp (d) 16 kbytes 1 kbyte 2 1 kbyte plqp0032gb-a r5f212f2dxxxfp (d) 8 kbytes 1 kbyte 2 512 bytes plqp0032gb-a d version factory programming product (1) R5F212F4DXXXFP (d) 16 kbytes 1 kbyte 2 1 kbyte plqp0032gb-a part no. r 5 f 21 2f 2 n xxx fp package type: fp: plqp0032gb-a rom number (only factor y programming product) classification n: operating ambient temperature -20c to 85c d: operating ambient temperature -40c to 85c rom capacity 2: 8 kb 4: 16 kb r8c/2f group r8c/tiny series memory type f: flash memory version renesas mcu renesas semiconductor
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 8 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change 1.3 block diagram figure 1.3 shows a block diagram. figure 1.3 block diagram watchdog timer (15 bits) r8c/tiny series cpu core memory rom (1) ram (2) multiplier r0h r0l r1h r2 r3 r1l a0 a1 fb sb usp isp intb pc flg i/o ports notes: 1. rom size varies with mcu type. 2. ram size varies with mcu type. system clock generation circuit xin-xout high-speed on-chip oscillator low-speed on-chip oscillator timers timer ra (8 bits 1) timer rb (8 bits 1) timer rc (16 bits 1) timer re (8 bits 1) a/d converter (10 bits 12 channels) uart or clock synchronous serial i/o (8 bits 1) comparator ( 2) lin module 8 port p0 8 port p1 6 port p3 1 3 port p4 2 port p5 peripheral functions d/a converter (8 bits 2)
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 9 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 1.4 pin assignment figure 1.4 shows pin assignments (top view). table 1.7 outlines the pin name information by pin number. figure 1.4 pin assignments (top view) notes: 1. p4_7 is an input-only port. 2. can be assigned to the pin in parentheses by a program. 3. confirm the pin 1 position on the package by referring to the package dimensions. xin/p4_6 xout/p4_7 (1) vss/avss reset vcc/avcc p3_7/trao mode p4_5/int0 p1_7/traio/int1 p3_6/(int1) (2) p3_5/(trciod) (2) p1_0/ki0/an8 p1_4/txd0 vref/p4_2 p1_3/ki3/an11/(trbo) (2) p3_3/int3/trcclk p1_1/ki1/an9/trcioa/trctrg p1_2/ki2/an10/trciob p0_3/an4/avref1 p0_2/an5/acmp1 p0_1/an6 p0_0/an7 p0_7/an0/da1 p0_6/an1/da0 p0_5/an2/avref0 p1_5/rxd0/(traio)/(int1) (2) p1_6/clk0 p5_3/trcioc/acout0 p5_4/trciod/acout1 p3_1/trbo p3_4/(trcioc) (2) p0_4/an3/treo/acmp0 29 28 27 26 25 32 31 30 9 10 11 12 13 14 15 16 24 23 22 21 20 19 18 17 578 1234 6 r8c/2e group, r8c/2f group plqp0032gb-a (32p6u-a) (top view)
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 10 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change note: 1. can be assigned to the pin in parentheses by a program. table 1.7 pin name information by pin number pin number control pin port i/o pin functions for of peripheral modules interrupt timer serial interface a/d converter d/a converter comparator 1 p3_5 (trciod) (1) 2 p3_7 trao 3 reset 4 xout p4_7 5 vss/avss 6 xin p4_6 7vcc/avcc 8mode 9 p4_5 int0 10 p1_7 int1 traio 11 p3_6 (int1 ) (1) 12 p3_1 trbo 13 p5_4 trciod acout1 14 p5_3 trcioc acout0 15 p1_6 clk0 16 p1_5 (int1 ) (1) (traio) (1) rxd0 17 p1_4 txd0 18 p1_3 ki3 (trbo) (1) an11 19 p1_2 ki2 trciob an10 20 vref p4_2 21 p1_1 ki1 trcioa/ trctrg an9 22 p1_0 ki0 an8 23 p3_3 int3 trcclk 24 p3_4 (trcioc) (1) 25 p0_7 an0 da1 26 p0_6 an1 da0 27 p0_5 an2 avref0 28 p0_4 treo an3 acmp0 29 p0_3 an4 avref1 30 p0_2 an5 acmp1 31 p0_1 an6 32 p0_0 an7
r8c/2e group, r8c/2f group 1. overview rev.0.10 aug 01, 2007 page 11 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 1.5 pin functions table 1.8 list pin functions. i: input o: output i/o: input and output note: 1. refer to the oscillator manufacturer for oscillation characteristics. table 1.8 pin functions type symbol i/o type description power supply input vcc, vss i apply 2.7 v to 5.5 v to the vcc pin. apply 0 v to the vss pin. analog power supply input avcc, avss i power supply for the a/d converter. connect a capacitor between avcc and avss. reset input reset i input ?l? on this pin resets the mcu. mode mode i connect this pin to vcc via a resistor. xin clock input xin i these pins are provid ed for xin clock generation circuit i/o. connect a ceramic resonator or a crystal oscillator between the xin and xout pins. (1) to use an external clock, input it to the xin pin and leave the xout pin open. xin clock output xout o int interrupt input int0 , int1 , int3 iint interrupt input pins key input interrupt ki0 to ki3 i key input interrupt input pins timer ra trao o timer ra output pin traio i/o timer ra i/o pin timer rb trbo o timer rb output pin timer rc trcclk i external clock input pin trctrg i external trigger input pin trcioa, trciob, trcioc, trciod i/o sharing output-compare output / input-capture input / pwm / pwm2 output pins timer re treo o timer re output pin serial interface clk0 i/o clock i/o pin rxd0 i receive data input pin txd0 o transmit data output pin reference voltage input vref i reference voltage input pin to a/d converter a/d converter an0 to an11 i analog input pins to a/d converter d/a converter da0 to da1 o output pins from d/a converter comparator avref0 to avref1 i reference voltage input pins to comparator acmp0 to acmp1 i analog voltage input pins to comparator acout0 to acout1 o comparison resu lt output pins of comparator i/o port p0_0 to p0_7, p1_0 to p1_7, p3_1, p3_3 to p3_7, p4_5, p5_3, p5_4 i/o cmos i/o ports. each port has an i/o select direction register, allowing each pin in the port to be directed for input or output individually. any port set to input can be set to use a pull-up resistor or not by a program. p1_0 to p1_7 also function as led drive ports. input port p4_2, p4_6, p4_7 i input-only ports
r8c/2e group, r8c/2f group 2. central processing unit (cpu) rev.0.10 aug 01, 2007 page 12 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 2. central processi ng unit (cpu) figure 2.1 shows the cpu registers. the cpu contains 13 registers. r0, r1, r2, r3, a0, a1, and fb configure a register bank. there are two sets of register bank. figure 2.1 cpu registers r2 b31 b15 b8b7 b0 data registers (1) address registers (1) r3 r0h (high-order of r0) r2 r3 a0 a1 intbh b15 b19 b0 intbl fb frame base register (1) the 4 high order bits of intb are intbh and the 16 low order bits of intb are intbl. interrupt table register b19 b0 usp program counter isp sb user stack pointer interrupt stack pointer static base register pc flg flag register carry flag debug flag zero flag sign flag register bank select flag overflow flag interrupt enable flag stack pointer select flag reserved bit processor interrupt priority level reserved bit c ipl d z s b o i u b15 b0 b15 b0 b15 b0 b8 b7 note: 1. these registers comprise a regist er bank. there are two register banks. r1h (high-order of r1) r0l (low-order of r0) r1l (low-order of r1)
r8c/2e group, r8c/2f group 2. central processing unit (cpu) rev.0.10 aug 01, 2007 page 13 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 2.1 data registers (r 0, r1, r2, and r3) r0 is a 16-bit register for transfer, ar ithmetic, and logic operations. the same applies to r1 to r3. r0 can be split into high-order bits (r0h) and low-order bits (r0l) to be used separately as 8-bit data registers. r1h and r1l are analogous to r0h and r0l. r2 can be combined with r0 and used as a 32-bit data register (r2r0). r3r1 is analogous to r2r0. 2.2 address registers (a0 and a1) a0 is a 16-bit register for address register indirect addr essing and address register relative addressing. it is also used for transfer, arithmetic, and logic operations. a1 is analogous to a0. a1 can be combined with a0 to be used as a 32-bit address register (a1a0). 2.3 frame base register (fb) fb is a 16-bit register for fb relative addressing. 2.4 interrupt table register (intb) intb is a 20-bit register th at indicates the start address of an interrupt vector table. 2.5 program counter (pc) pc is 20 bits wide and indicates the addres s of the next instruction to be executed. 2.6 user stack pointer (usp) a nd interrupt stack pointer (isp) the stack pointers (sp), usp, and isp, are each 16 bits wide. the u flag of flg is used to switch between usp and isp. 2.7 static base register (sb) sb is a 16-bit register for sb relative addressing. 2.8 flag register (flg) flg is an 11-bit register indicating the cpu state. 2.8.1 carry flag (c) the c flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit. 2.8.2 debug flag (d) the d flag is for debugging only. set it to 0. 2.8.3 zero flag (z) the z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0. 2.8.4 sign flag (s) the s flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0. 2.8.5 register bank select flag (b) register bank 0 is selected when the b flag is 0. regi ster bank 1 is selected when this flag is set to 1. 2.8.6 overflow flag (o) the o flag is set to 1 when an operation results in an overflow; otherwise to 0.
r8c/2e group, r8c/2f group 2. central processing unit (cpu) rev.0.10 aug 01, 2007 page 14 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 2.8.7 interrupt enable flag (i) the i flag enables maskable interrupts. interrupt are disabled when the i flag is set to 0, and are enabled when the i flag is set to 1. the i flag is set to 0 when an interrupt request is acknowledged. 2.8.8 stack pointer select flag (u) isp is selected when the u flag is set to 0; usp is selected when the u flag is set to 1. the u flag is set to 0 when a hardware interrupt requ est is acknowledged or the int instruction of software interrupt numbers 0 to 31 is executed. 2.8.9 processor interrupt priority level (ipl) ipl is 3 bits wide and assigns processor interrupt priority le vels from level 0 to level 7. if a requested interrupt has higher priori ty than ipl, the interrupt is enabled. 2.8.10 reserved bit if necessary, set to 0. when read, the content is undefined.
r8c/2e group, r8c/2f group 3. memory rev.0.10 aug 01, 2007 page 15 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 3. memory 3.1 r8c/2e group figure 3.1 is a memory map of r8c/2e group. the r8c/ 2e group has 1 mbyte of address space from addresses 00000h to fffffh. the internal rom is allocated lower addresses, beginning with address 0ffffh. for example, a 16-kbyte internal rom area is allocated addr esses 0c000h to 0ffffh. the fixed interrupt vector table is al located addresses 0ffdch to 0ffffh. they store th e starting address of each interrupt routine. the internal ram is allocated highe r addresses beginning with address 00400h. for example, a 1-kbyte internal ram area is allocated addresses 00400h to 007ffh. the internal ram is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged. special function registers (sfrs) are allocated addresses 00000h to 002ffh. the peripheral function control registers are allocated here. all addresse s within the sfr, which have nothing allocated are reserved for future use and cannot be accessed by users. figure 3.1 memory map of r8c/2e group undefined instruction overflow brk instruction address match single step watchdog timer/oscillation stop detection/voltage monitor 2 (reserved) (reserved) reset 00400h 002ffh 00000h internal ram sfr (refer to 4. special function registers (sfrs) ) 0ffffh 0ffdch note: 1. the blank regions are reserved. do not access locations in these regions. fffffh 0ffffh 0yyyyh internal rom (program rom) expanded area 0xxxh part number internal rom internal ram size size r5f212e2nfp, r5f212e2dfp, r5f212e2nxxxfp, r5f212e2dxxxfp r5f212e4nfp, r5f212e4dfp, r5f212e4nxxxfp, r5f212e4dxxxfp 8 kbytes 16 kbytes 0e000h 0c000h 512 bytes 1 kbyte 005ffh 007ffh address 0yyyyh address 0xxxxh
r8c/2e group, r8c/2f group 3. memory rev.0.10 aug 01, 2007 page 16 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 3.2 r8c/2f group figure 3.2 is a memory map of r8c/2f group. the r8c/ 2f group has 1 mbyte of address space from addresses 00000h to fffffh. the internal rom (program rom) is allocated lower ad dresses, beginning with a ddress 0ffffh. for example, a 16-kbyte internal rom area is allocated addresses 0c000h to 0ffffh. the fixed interrupt vector table is al located addresses 0ffdch to 0ffffh. they store th e starting address of each interrupt routine. the internal rom (data flash) is allocated addresses 02400h to 02bffh. the internal ram area is allocated higher addresses, beginning with address 00400h. for example, a 1-kbyte internal ram is allocated addresses 00400h to 007ffh. the internal ram is used not only for storing data but also for calling subroutines and as stacks wh en interrupt requests are acknowledged. special function registers (sfrs) are allocated addresses 00000h to 002ffh. the peripheral function control registers are allocated here. all addresse s within the sfr, which have nothing allocated are reserved for future use and cannot be accessed by users. figure 3.2 memory map of r8c/2f group undefined instruction overflow brk instruction address match single step watchdog timer/oscillation stop detection/voltage monitor 2 (reserved) (reserved) reset fffffh 0ffffh 0yyyyh 00400h 002ffh 00000h internal rom (program rom) expanded area internal ram sfr (refer to 4. special function registers (sfrs) ) 0ffffh 0ffdch internal rom (data flash) (1) notes: 1. data flash block a (1 kbyte) and b (1 kbyte) are shown. 2. the blank regions are reserved. do not access locations in these regions. 0xxxxh 02400h 02bffh part number internal rom internal ram size size r5f212f2nfp, r5f212f2dfp, r5f212f2nxxxfp, r5f212f2dxxxfp r5f212f4nfp, r5f212f4dfp, r5f212f4nxxxfp, R5F212F4DXXXFP 8 kbytes 16 kbytes 0e000h 0c000h 512 bytes 1 kbyte 005ffh 007ffh address 0yyyyh address 0xxxxh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 17 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 4. special function registers (sfrs) an sfr (special function register) is a control register fo r a peripheral function. tables 4.1 to 4.7 list the special function registers. table 4.1 sfr information (1) (1) x: undefined notes: 1. the blank regions are reserved. do not access locations in these regions. 2. software reset, watchdog timer reset, and voltage monitor 1 reset or voltage monitor 2 reset do not affect this register. 3. software reset, watchdog timer reset, and voltage monitor 1 reset or voltage monitor 2 reset do not affect b2 and b3. 4. the csproini bit in the ofs register is set to 0. address register symbol after reset 0000h 0001h 0002h 0003h 0004h processor mode register 0 pm0 00h 0005h processor mode register 1 pm1 00h 0006h system clock control register 0 cm0 01101000b 0007h system clock control register 1 cm1 00100000b 0008h 0009h 000ah protect register prcr 00h 000bh 000ch oscillation stop detection register ocd 00000100b 000dh watchdog timer reset register wdtr xxh 000eh watchdog timer start register wdts xxh 000fh watchdog timer control register wdc 00x11111b 0010h address match interrupt register 0 rmad0 00h 0011h 00h 0012h 00h 0013h address match interrupt enable register aier 00h 0014h address match interrupt register 1 rmad1 00h 0015h 00h 0016h 00h 0017h 0018h 0019h 001ah 001bh 001ch count source protection mode register cspr 00h 10000000b (4) 001dh 001eh 001fh 0020h 0021h 0022h 0023h high-speed on-chip oscillator control register 0 fra0 00h 0024h high-speed on-chip oscillator control register 1 fra1 when shipping 0025h high-speed on-chip oscillator control register 2 fra2 00h 0026h 0027h 0028h 0029h 002ah 002bh 0030h 0031h voltage detection register 1 (2) vca1 00001000b 0032h voltage detection register 2 (2) vca2 00100000b 0033h 0034h 0035h 0036h voltage monitor 1 circuit control register (3) vw1c 00001000b 0037h voltage monitor 2 circuit control register (3) vw2c 00h 0038h 0039h 003ah 003bh 003ch 003dh 003eh 003fh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 18 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.2 sfr information (2) (1) x: undefined note: 1. the blank regions are reserved. do not access locations in these regions. address register symbol after reset 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h timer rc interrupt control register trcic xxxxx000b 0048h 0049h 004ah timer re interrupt control register treic xxxxx000b 004bh 004ch 004dh key input interrupt control register kupic xxxxx000b 004eh a/d conversion interrupt control register adic xxxxx000b 004fh 0050h 0051h uart0 transmit interrupt control register s0tic xxxxx000b 0052h uart0 receive interrupt control register s0ric xxxxx000b 0053h 0054h 0055h 0056h timer ra interrupt control register traic xxxxx000b 0057h 0058h timer rb interrupt control register trbic xxxxx000b 0059h int1 interrupt control register int1ic xx00x000b 005ah int3 interrupt control register int3ic xx00x000b 005bh comparator 0 interrupt control register cm0ic xxxxx000b 005ch comparator 1 interrupt control register cm1ic xxxxx000b 005dh int0 interrupt control register int0ic xx00x000b 005eh 005fh 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006ah 006bh 006ch 006dh 006eh 006fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007ah 007bh 007ch 007dh 007eh 007fh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 19 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.3 sfr information (3) (1) x: undefined note: 1. the blank regions are reserved. do not access locations in these regions. address register symbol after reset 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h 0088h 0089h 008ah 008bh 008ch 008dh 008eh 008fh 0090h 0091h 0092h 0093h 0094h 0095h 0096h 0097h 0098h 0099h 009ah 009bh 009ch 009dh 009eh 009fh 00a0h uart0 transmit/receive mode register u0mr 00h 00a1h uart0 bit rate register u0brg xxh 00a2h uart0 transmit buffer register u0tb xxh 00a3h xxh 00a4h uart0 transmit/receive control register 0 u0c0 00001000b 00a5h uart0 transmit/receive control register 1 u0c1 00000010b 00a6h uart0 receive buffer register u0rb xxh 00a7h xxh 00a8h 00a9h 00aah 00abh 00ach 00adh 00aeh 00afh 00b0h 00b1h 00b2h 00b3h 00b4h 00b5h 00b6h 00b7h 00b8h 00b9h 00bah 00bbh 00bch 00bdh 00beh 00bfh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 20 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.4 sfr information (4) (1) x: undefined note: 1. the blank regions are reserved. do not access locations in these regions. address register symbol after reset 00c0h a/d register ad xxh 00c1h xxh 00c2h 00c3h 00c4h 00c5h 00c6h 00c7h 00c8h 00c9h 00cah 00cbh 00cch 00cdh 00ceh 00cfh 00d0h 00d1h 00d2h 00d3h 00d4h a/d control register 2 adcon2 00h 00d5h 00d6h a/d control register 0 adcon0 00h 00d7h a/d control register 1 adcon1 00h 00d8h d/a register 0 da0 00h 00d9h 00dah d/a register 1 da1 00h 00dbh 00dch d/a control register dacon 00h 00ddh 00deh 00dfh 00e0h port p0 register p0 00h 00e1h port p1 register p1 00h 00e2h port p0 direction register pd0 00h 00e3h port p1 direction register pd1 00h 00e4h 00e5h port p3 register p3 00h 00e6h 00e7h port p3 direction register pd3 00h 00e8h port p4 register p4 00h 00e9h port p5 register p5 00h 00eah port p4 direction register pd4 00h 00ebh port p5 direction register pd5 00h 00ech 00edh 00eeh 00efh 00f0h 00f1h 00f2h 00f3h 00f4h 00f5h 00f6h pin select register 2 pinsr2 00h 00f7h pin select register 3 pinsr3 00h 00f8h port mode register pmr 00h 00f9h external input enable register inten 00h 00fah int input filter select register intf 00h 00fbh key input enable register kien 00h 00fch pull-up control register 0 pur0 00h 00fdh pull-up control register 1 pur1 00h 00feh port p1 drive capacity control register p1drr 00h 00ffh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 21 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.5 sfr information (5) (1) x: undefined note: 1. the blank regions are reserved. do not access locations in these regions. address register symbol after reset 0100h timer ra control register tracr 00h 0101h timer ra i/o control register traioc 00h 0102h timer ra mode register tramr 00h 0103h timer ra prescaler register trapre ffh 0104h timer ra register tra ffh 0105h 0106h lin control register lincr 00h 0107h lin status register linst 00h 0108h timer rb control register trbcr 00h 0109h timer rb one-shot control register trbocr 00h 010ah timer rb i/o control register trbioc 00h 010bh timer rb mode register trbmr 00h 010ch timer rb prescaler register trbpre ffh 010dh timer rb secondary register trbsc ffh 010eh timer rb primary register trbpr ffh 010fh 0110h 0111h 0112h 0113h 0114h 0115h 0116h 0117h 0118h timer re counter data register tresec 00h 0119h timer re compare data register tremin 00h 011ah 011bh 011ch timer re control register 1 trecr1 00h 011dh timer re control register 2 trecr2 00h 011eh timer re clock source select register trecsr 00001000b 011fh 0120h timer rc mode register trcmr 01001000b 0121h timer rc control register 1 trccr1 00h 0122h timer rc interrupt enable register trcier 01110000b 0123h timer rc status register trcsr 01110000b 0124h timer rc i/o control register 0 trcior0 10001000b 0125h timer rc i/o control register 1 trcior1 10001000b 0126h timer rc counter trc 00h 0127h 00h 0128h timer rc general register a trcgra ffh 0129h ffh 012ah timer rc general register b trcgrb ffh 012bh ffh 012ch timer rc general register c trcgrc ffh 012dh ffh 012eh timer rc general register d trcgrd ffh 012fh ffh 0130h timer rc control register 2 trccr2 00011111b 0131h timer rc digital filter function select register trcdf 00h 0132h timer rc output master enable register trcoer 0 1111111b 0133h 0134h 0135h 0136h 0137h 0138h 0139h 013ah 013bh 013ch 013dh 013eh 013fh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 22 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.6 sfr information (6) (1) x: undefined note: 1. the blank regions are reserved. do not access locations in these regions. address register symbol after reset 0140h 0141h 0142h 0143h 0144h 0145h 0146h 0147h 0148h 0149h 014ah 014bh 014ch 014dh 014eh 014fh 0150h 0151h 0152h 0153h 0154h 0155h 0156h 0157h 0158h 0159h 015ah 015bh 015ch 015dh 015eh 015fh 0160h 0161h 0162h 0163h 0164h 0165h 0166h 0167h 0168h 0169h 016ah 016bh 016ch 016dh 016eh 016fh 0170h 0171h 0172h 0173h 0174h comparator 0 control register accr0 00001000b 0175h comparator 1 control register accr1 00001000b 0176h 0177h comparator mode register acmr 00h 0178h 0179h 017ah 017bh 017ch 017dh 017eh 017fh
r8c/2e group, r8c/2f group 4. sp ecial function registers (sfrs) rev.0.10 aug 01, 2007 page 23 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 4.7 sfr information (7) (1) x: undefined notes: 1. the blank regions are reserved. do not access locations in these regions. 2. the ofs register cannot be changed by a pr ogram. use a flash programmer to write to it. address register symbol after reset 0180h 0181h 0182h 0183h 0184h 0185h 0186h 0187h 0188h 0189h 018ah 018bh 018ch 018dh 018eh 018fh 0190h 0191h 0192h 0193h 0194h 0195h 0196h 0197h 0198h 0199h 019ah 019bh 019ch 019dh 019eh 019fh 01a0h 01a1h 01a2h 01a3h 01a4h 01a5h 01a6h 01a7h 01a8h 01a9h 01aah 01abh 01ach 01adh 01aeh 01afh 01b0h 01b1h 01b2h 01b3h flash memory control register 4 fmr4 01000000b 01b4h 01b5h flash memory control register1 fmr1 1000000xb 01b6h 01b7h flash memory control register 0 fmr0 00000001b 01b8h 01b9h 01bah 01bbh 01bch 01bdh 01beh 01bfh ffffh option function select register ofs (note 2)
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 24 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change 5. electrical characteristics notes: 1. v cc = 2.7 to 5.5 v at t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. 2. the typical values when average output current is 100 ms. table 5.1 absolute maximum ratings symbol parameter condition rated value unit v cc /av cc supply voltage ? 0.3 to 6.5 v v i input voltage ? 0.3 to v cc + 0.3 v v o output voltage ? 0.3 to v cc + 0.3 v p d power dissipation t opr = 25 c500mw t opr operating ambient temperature ? 20 to 85 (n version) / ? 40 to 85 (d version) c t stg storage temperature ? 65 to 150 c table 5.2 recommended operating conditions symbol parameter conditions standard unit min. typ. max. v cc /av cc supply voltage 2.7 ? 5.5 v v ss /av ss supply voltage ? 0 ? v v ih input ?h? voltage 0.8 v cc ? v cc v v il input ?l? voltage 0 ? 0.2 v cc v i oh(sum) peak sum output ?h? current sum of all pins i oh(peak) ??? 160 ma i oh(sum) average sum output ?h? current sum of all pins i oh(avg) ?? 80 ma i oh(peak) peak output ?h? current except p1_0 to p1_7 ??? 10 ma p1_0 to p1_7 ??? 20 ma i oh(avg) average output ?h? current except p1_0 to p1_7 ??? 5ma p1_0 to p1_7 ??? 10 ma i ol(sum) peak sum output ?l? currents sum of all pins i ol(peak) ?? 160 ma i ol(sum) average sum output ?l? currents sum of all pins i ol(avg) ?? 80 ma i ol(peak) peak output ?l? currents except p1_0 to p1_7 ?? 10 ma p1_0 to p1_7 ?? 20 ma i ol(avg) average output ?l? current except p1_0 to p1_7 ?? 5ma p1_0 to p1_7 ?? 10 ma f (xin) xin clock input oscillation frequency 3.0 v v cc 5.5 v 0 ? 20 mhz 2.7 v v cc < 3.0 v 0 ? 10 mhz ? system clock ocd2 = 0 xln clock selected 3.0 v v cc 5.5 v 0 ? 20 mhz 2.7 v v cc < 3.0 v 0 ? 10 mhz ocd2 = 1 on-chip oscillator clock selected fra01 = 0 low-speed on-chip oscillator clock selected ? 125 ? khz fra01 = 1 high-speed on-chip oscillator clock selected 3.0 v v cc 5.5 v ?? 20 mhz fra01 = 1 high-speed on-chip oscillator clock selected 2.7 v v cc 5.5 v ?? 10 mhz
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 25 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change figure 5.1 ports p0, p1, and p3 to p5 timing measurement circuit notes: 1. av cc = 2.7 to 5.5 v at t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. 2. when the analog input voltage is over the reference voltage, the a/d conversion result will be 3ffh in 10-bit mode and ffh in 8-bit mode. notes: 1. av cc = 2.7 to 5.5 v at t opr = -20 to 85 c (n version) / -40 to 85 c (d version), unless otherwise specified. 2. this applies when one d/a converter is used and the value of t he dai register (i = 0 or 1) for the unused d/a converter is 00 h. the resistor ladder of the a/d converter is not included. also, even if the vcut bit in the adcon1 register is set to 0 (v ref not connected), i vref flows into the d/a converters. table 5.3 a/d converter characteristics symbol parameter conditions standard unit min. typ. max. ? resolution v ref = av cc ?? 10 bits ? absolute accuracy 10-bit mode ad = 10 mhz, v ref = av cc = 5.0 v ?? 3 lsb 8-bit mode ad = 10 mhz, v ref = av cc = 5.0 v ?? 2 lsb 10-bit mode ad = 10 mhz, v ref = av cc = 3.3 v ?? 5 lsb 8-bit mode ad = 10 mhz, v ref = av cc = 3.3 v ?? 2 lsb r ladder resistor ladder v ref = av cc 10 ? 40 k ? t conv conversion time 10-bit mode ad = 10 mhz, v ref = av cc = 5.0 v 3.3 ?? s 8-bit mode ad = 10 mhz, v ref = av cc = 5.0 v 2.8 ?? s v ref reference voltage 2.7 ? av cc v v ia analog input voltage (2) 0 ? av cc v ? a/d operating clock frequency without sample and hold v ref = av cc = 2.7 to 5.5 v 0.25 ? 10 mhz with sample and hold v ref = av cc = 2.7 to 5.5 v 1 ? 10 mhz table 5.4 d/a converter characteristics symbol parameter conditions standard unit min. typ. max. ? resolution ?? 8bit ? absolute accuracy ?? 1.0 % t su setup time ?? 3 s r o output resistor 4 10 20 k ? i vref reference power input current (note 2) ?? 1.5 ma p0 p1 p3 p4 p5 30pf
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 26 of 39 rej03b0222-0010 under development preliminary specification specications in this manual ar e tentative and subject to change note: 1. v cc = 2.7 to 5.5 v at t opr = -20 to 85 table 5.5 comparator characteristics (1) symbol parameter conditions standard unit min. typ. max. v cref comparator reference voltage 0 ? ? ? ? ?? ?? table 5.6 flash memory (program rom) electrical characteristics symbol parameter conditions standard unit min. typ. max. ? ?? ?? ? ? ? ? ?? ? ?? ? ?? ? ?? ? ? ? ? ? ? ? ??
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 27 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change notes: 1. v cc = 2.7 to 5.5 v at t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. 2. definition of programming/erasure endurance the programming and erasure endurance is defined on a per-block basis. if the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. for example, if 1,024 1-byte writes are performed to block a, a 1 kbyte block, and then the block is erased, the programming/erasure endurance still stands at one. however, the same address must not be programmed more than once per erase operation (overwriting prohibited). 3. endurance to guarantee all electrical characteristics after program and erase. (1 to min. value can be guaranteed). 4. standard of block a and block b when program and erase endurance exceeds 1,000 times. byte program time to 1,000 times is the same as that in program rom. 5. in a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possib le is used up before performing an erase operation. for example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups before erasing them all in one operation. it is also advisable to retain data on the erase count of each block and limit the number of erase operations to a certain number. 6. if an error occurs during block erase, attempt to execute t he clear status register command, then execute the block erase command at least three times until the erase error does not occur. 7. customers desiring program/erase failure rate information should contact their renesas te chnical support representative. 8. ? 40 c for d version. 9. the data hold time includes time that the po wer supply is off or the clock is not supplied. table 5.7 flash memory (data flash block a, block b) electrical characteristics (4) symbol parameter conditions standard unit min. typ. max. ? program/erase endurance (2) 10,000 (3) ?? times ? byte program time (program/erase endurance 1,000 times) ? 50 400 s ? byte program time (program/erase endurance > 1,000 times) ? 65 ? s ? block erase time (program/erase endurance 1,000 times) ? 0.2 9 s ? block erase time (program/erase endurance > 1,000 times) ? 0.3 ? s t d(sr-sus) time delay from suspend request until suspend ?? 97+cpu clock 6 cycles s ? interval from erase start/restart until following suspend request 650 ?? s ? interval from program start/restart until following suspend request 0 ?? ns ? time from suspend until program/erase restart ?? 3+cpu clock 4 cycles s ? program, erase voltage 2.7 ? 5.5 v ? read voltage 2.7 ? 5.5 v ? program, erase temperature ? 20 (8) ? 85 c ? data hold time (9) ambient temperature = 55 c20 ?? year
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 28 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change figure 5.2 time delay until suspend notes: 1. the measurement condition is v cc = 2.7 v to 5.5 v and t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version). 2. time until the voltage monitor 1 interrupt request is generated after the voltage passes v det1 . 3. necessary time until the voltage detection circuit operates when setting to 1 again after setting the vca26 bit in the vca2 register to 0. 4. this parameter shows the voltage detection level when the power supply drops. the voltage detection level when the power supply rises is higher than the voltage detection level when the power supply drops by approximately 0.1 v. notes: 1. the measurement condition is v cc = 2.7 v to 5.5 v and t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version). 2. time until the voltage monitor 2 interrupt request is generated after the voltage passes v det2 . 3. necessary time until the voltage detection circuit operates after setting to 1 again af ter setting the vca27 bit in the vca2 register to 0. table 5.8 voltage detection 1 circuit electrical characteristics symbol parameter condition standard unit min. typ. max. v det1 voltage detection level (4) 2.7 2.85 3.00 v ? voltage monitor 1 interrupt request generation time (2) ? 40 ? s ? voltage detection circuit self power consumption vca26 = 1, v cc = 5.0 v ? 0.6 ? a t d(e-a) waiting time until voltage detection circuit operation starts (3) ?? 100 s vccmin mcu operating voltage minimum value 2.7 ?? v table 5.9 voltage detection 2 circuit electrical characteristics symbol parameter condition standard unit min. typ. max. v det2 voltage detection level 3.3 3.6 3.9 v ? voltage monitor 2 interrupt request generation time (2) ? 40 ? s ? voltage detection circuit self power consumption vca27 = 1, v cc = 5.0 v ? 0.6 ? a t d(e-a) waiting time until voltage detection circuit operation starts (3) ?? 100 s fmr46 suspend request (maskable interrupt request) fixed time t d(sr-sus) clock-dependent time access restart
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 29 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change notes: 1. the measurement condition is t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. 2. this condition (external power v cc rise gradient) does not apply if v cc 1.0 v. 3. t w(por1) indicates the duration the external power v cc must be held below the effective voltage (v por1 ) to enable a power on reset. when turning on the power for the first time, maintain t w(por1) for 30 s or more if ? 20 c t opr 85 c, maintain t w(por1) for 3,000 s or more if ? 40 c t opr < ? 20 c. figure 5.3 reset circuit electrical characteristics table 5.10 power-on reset circuit, voltage monitor 0 reset electrical characteristics symbol parameter condition standard unit min. typ. max. v por1 power-on reset valid voltage (3) ?? 0.1 v v por2 power-on reset valid voltage 0 ? 2.6 v t rth external power v cc rise gradient (2) 20 ?? mv/msec notes: 1. ensure that the voltage is 2.2 v or above during the sampling time. 2. the sampling time is foco-s divided by 1 4 cycles. max. 2.6 v v por1 internal reset signal (?l? valid) t w(por1) sampling time (1, 2) max. 2.6 v 1 f oco-s 32 1 f oco-s 32 v por2 2.2 v external power v cc t rth t rth
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 30 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change notes: 1. v cc = 2.7 to 5.5 v, t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. 2. these standard values show when the fra1 register value after reset is assumed. note: 1. v cc = 2.7 to 5.5 v, t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified. notes: 1. the measurement condition is v cc = 2.7 to 5.5 v and t opr = 25 c. 2. waiting time until the internal power s upply generation circuit stabilizes during power-on. 3. time until system clock supply starts after the interrupt is acknowledged to exit stop mode. table 5.11 high-speed on-chip oscillator circuit electrical characteristics symbol parameter condition standard unit min. typ. max. foco40m high-speed on-chip oscillator frequency temperature supply voltage dependence v cc = 4.75 v to 5.25 v 0 c t opr 60 c (2) 39.2 40 40.8 mhz v cc = 3.0 v to 5.5 v ? 20 c t opr 85 c (2) 38.8 40 41.2 mhz v cc = 3.0 v to 5.5 v ? 40 c t opr 85 c (2) 38.4 40 41.6 mhz v cc = 2.7 v to 5.5 v ? 20 c t opr 85 c (2) 38 40 42 mhz v cc = 2.7 v to 5.5 v ? 40 c t opr 85 c (2) 37.6 40 42.4 mhz v cc = 5.0 v 10% ? 20 c t opr 85 c (2) 38.8 40 40.8 mhz v cc = 5.0 v 10% ? 40 c t opr 85 c (2) 38.4 40 40.8 mhz ? value in fra1 register after reset 08h ? f7h ? ? oscillation fr equency adjustment unit of high- speed on-chip oscillator adjust fra1 register (value after reset) to ? 1 ? +0.3 ? mhz ? oscillation st ability time ? 10 100 s ? self power consumption at oscillation v cc = 5.0 v, t opr = 25 c ? 400 ? a table 5.12 low-speed on-chip oscillator circuit electrical characteristics symbol parameter condition standard unit min. typ. max. foco-s low-speed on-chip oscillator frequency 30 125 250 khz ? oscillation st ability time ? 10 100 s ? self power consumption at oscillation v cc = 5.0 v, t opr = 25 c ? 15 ? a table 5.13 power supply circuit timing characteristics symbol parameter condition standard unit min. typ. max. t d(p-r) time for internal power supply stabilization during power-on (2) 1 ? 2000 s t d(r-s) stop exit time (3) ?? 150 s
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 31 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change note: 1. v cc = 4.2 to 5.5 v at t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), f (xin) = 20 mhz, unless otherwise specified. table 5.14 electrical characteristics (1) [v cc = 5 v] symbol parameter condition standard unit min. typ. max. v oh output ?h? voltage except p1_0 to p1_7, xout i oh = ? 5 ma v cc ? 2.0 ? v cc v i oh = ? 200 av cc ? 0.5 ? v cc v p1_0 to p1_7 drive capacity high i oh = ? 10 ma v cc ? 2.0 ? v cc v drive capacity low i oh = ? 5 ma v cc ? 2.0 ? v cc v xout drive capacity high i oh = ? 1 ma v cc ? 2.0 ? v cc v drive capacity low i oh = ? 500 av cc ? 2.0 ? v cc v v ol output ?l? voltage except p1_0 to p1_7, xout i ol = 5 ma ?? 2.0 v i ol = 200 a ?? 0.45 v p1_0 to p1_7 drive capacity high i ol = 10 ma ?? 2.0 v drive capacity low i ol = 5 ma ?? 2.0 v xout drive capacity high i ol = 1 ma ?? 2.0 v drive capacity low i ol = 500 a ?? 2.0 v v t+- v t- hysteresis int0 , int1 , int3 , ki0 , ki1 , ki2 , ki3 , traio, rxd0, clk0 0.1 0.5 ? v reset 0.1 1.0 ? v i ih input ?h? current vi = 5 v, v cc = 5 v ?? 5.0 a i il input ?l? current vi = 0 v, v cc = 5 v ??? 5.0 a r pullup pull-up resistance vi = 0 v, v cc = 5 v 30 50 167 k ? r fxin feedback resistance xin ? 1.0 ? m ? v ram ram hold voltage during stop mode 1.8 ?? v
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 32 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 5.15 electrical characteristics (2) [vcc = 5 v] (t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified.) symbol parameter condition standard unit min. typ. max. i cc power supply current (v cc = 3.3 to 5.5 v) single-chip mode, output pins are open, other pins are v ss high-speed clock mode xin = 20 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz no division ? 10 17 ma xin = 16 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz no division ? 915ma xin = 10 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz no division ? 6 ? ma xin = 20 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8 ? 5 ? ma xin = 16 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8 ? 4 ? ma xin = 10 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8 ? 2.5 ? ma high-speed on-chip oscillator mode xin clock off high-speed on-chip oscillator on foco = 20 mhz low-speed on-chip oscillator on = 125 khz no division ? 10 15 ma xin clock off high-speed on-chip oscillator on foco = 20 mhz low-speed on-chip oscillator on = 125 khz divide-by-8 ? 4 ? ma xin clock off high-speed on-chip oscillator on foco = 10 mhz low-speed on-chip oscillator on = 125 khz no division ? 5.5 10 ma xin clock off high-speed on-chip oscillator on foco = 10 mhz low-speed on-chip oscillator on = 125 khz divide-by-8 ? 2.5 ? ma low-speed on-chip oscillator mode xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8, fmr47 = 1 ? 130 300 a wait mode xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz while a wait instruction is executed peripheral clock operation vca27 = vca26 = 0 vca20 = 1 ? 25 75 a xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz while a wait instruction is executed peripheral clock off vca27 = vca26 = 0 vca20 = 1 ? 23 60 a stop mode xin clock off, t opr = 25 c high-speed on-chip oscillator off low-speed on-chip oscillator off cm10 = 1 peripheral clock off vca27 = vca26 = 0 ? 0.8 3.0 a xin clock off, t opr = 85 c high-speed on-chip oscillator off low-speed on-chip oscillator off cm10 = 1 peripheral clock off vca27 = vca26 = 0 ? 1.2 ? a
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 33 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change timing requirements (unless otherwise specified: v cc = 5 v, v ss = 0 v at t opr = 25 c) [v cc = 5 v] figure 5.4 xin input timing diagram when v cc = 5 v figure 5.5 traio input timing diagram when v cc = 5 v table 5.16 xin input symbol parameter standard unit min. max. t c(xin) xin input cycle time 50 ? ns t wh(xin) xin input ?h? width 25 ? ns t wl(xin) xin input ?l? width 25 ? ns table 5.17 traio input symbol parameter standard unit min. max. t c(traio) traio input cycle time 100 ? ns t wh(traio) traio input ?h? width 40 ? ns t wl(traio) traio input ?l? width 40 ? ns xin input t wh(xin) t c(xin) t wl(xin) v cc = 5 v traio input v cc = 5 v t c(traio) t wl(traio) t wh(traio)
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 34 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change figure 5.6 serial interface timing diagram when v cc = 5 v notes: 1. when selecting the digital filter by the inti input filter select bit, use an inti input high width of either (1/digital filter clock frequency 3) or the minimum value of standard, whichever is greater. 2. when selecting the digital filter by the inti input filter select bit, use an inti input low width of either (1/digital filter clock frequency 3) or the minimum value of standard, whichever is greater. figure 5.7 external interrupt inti input timing diagram when v cc = 5 v table 5.18 serial interface symbol parameter standard unit min. max. t c(ck) clk0 input cycle time 200 ? ns t w(ckh) clk0 input ?h? width 100 ? ns t w(ckl) clk0 input ?l? width 100 ? ns t d(c-q) txd0 output delay time ? 50 ns t h(c-q) txd0 hold time 0 ? ns t su(d-c) rxd0 input setup time 50 ? ns t h(c-d) rxd0 input hold time 90 ? ns table 5.19 external interrupt inti (i = 0, 1, 3) input symbol parameter standard unit min. max. t w(inh) inti input ?h? width 250 (1) ? ns t w(inl) inti input ?l? width 250 (2) ? ns t w(ckh) t c(ck) t w(ckl) t h(c-q) t h(c-d) t su(d-c) t d(c-q) clk0 txd0 rxd0 v cc = 5 v inti input t w(inl) t w(inh) i = 0, 1, 3 v cc = 5 v
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 35 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change note: 1. v cc =2.7 to 3.3 v at t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), f (xin) = 10 mhz, unless otherwise specified. table 5.20 electrical characteristics (3) [v cc = 3 v] symbol parameter condition standard unit min. typ. max. v oh output ?h? voltage except p1_0 to p1_7, xout i oh = ? 1 ma v cc ? 0.5 ? v cc v p1_0 to p1_7 drive capacity high i oh = ? 2 ma v cc ? 0.5 ? v cc v drive capacity low i oh = ? 1 ma v cc ? 0.5 ? v cc v xout drive capacity high i oh = ? 0.1 ma v cc ? 0.5 ? v cc v drive capacity low i oh = ? 50 av cc ? 0.5 ? v cc v v ol output ?l? voltage except p1_0 to p1_7, xout i ol = 1 ma ?? 0.5 v p1_0 to p1_7 drive capacity high i ol = 2 ma ?? 0.5 v drive capacity low i ol = 1 ma ?? 0.5 v xout drive capacity high i ol = 0.1 ma ?? 0.5 v drive capacity low i ol = 50 a ?? 0.5 v v t+- v t- hysteresis int0 , int1 , int3 , ki0 , ki1 , ki2 , ki3 , traio, rxd0, clk0 0.1 0.3 ? v reset 0.1 0.4 ? v i ih input ?h? current vi = 3 v, v cc = 3 v ?? 4.0 a i il input ?l? current vi = 0 v, v cc = 3 v ??? 4.0 a r pullup pull-up resistance vi = 0 v, v cc = 3 v 66 160 500 k ? r fxin feedback resistance xin ? 3.0 ? m ? v ram ram hold voltage during stop mode 1.8 ?? v
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 36 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change table 5.21 electrical characteristics (4) [vcc = 3 v] (t opr = ? 20 to 85 c (n version) / ? 40 to 85 c (d version), unless otherwise specified.) symbol parameter condition standard unit min. typ. max. i cc power supply current (v cc = 2.7 to 3.3 v) single-chip mode, output pins are open, other pins are v ss high-speed clock mode xin = 10 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz no division ? 6 ? ma xin = 10 mhz (square wave) high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8 ? 2 ? ma high-speed on-chip oscillator mode xin clock off high-speed on-chip oscillator on foco = 10 mhz low-speed on-chip oscillator on = 125 khz no division ? 59ma xin clock off high-speed on-chip oscillator on foco = 10 mhz low-speed on-chip oscillator on = 125 khz divide-by-8 ? 2 ? ma low-speed on-chip oscillator mode xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz divide-by-8, fmr47 = 1 ? 130 300 a wait mode xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz while a wait instruction is executed peripheral clock operation vca27 = vca26 = 0 vca20 = 1 ? 25 70 a xin clock off high-speed on-chip oscillator off low-speed on-chip oscillator on = 125 khz while a wait instruction is executed peripheral clock off vca27 = vca26 = 0 vca20 = 1 ? 23 55 a stop mode xin clock off , t opr = 25 c high-speed on-chip oscillator off low-speed on-chip oscillator off cm10 = 1 peripheral clock off vca27 = vca26 = 0 ? 0.7 3.0 a xin clock off , t opr = 85 c high-speed on-chip oscillator off low-speed on-chip oscillator off cm10 = 1 peripheral clock off vca27 = vca26 = 0 ? 1.1 ? a
r8c/2e group, r8c/2f group 5 . electrical characteristics rev.0.10 aug 01, 2007 page 37 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change timing requirements (unless otherwise specified: v cc = 3 v, v ss = 0 v at t opr = 25 c) [v cc = 3 v] figure 5.8 xin input timing diagram when v cc = 3 v figure 5.9 traio input timing diagram when v cc = 3 v table 5.22 xin input symbol parameter standard unit min. max. t c(xin) xin input cycle time 100 ? ns t wh(xin) xin input ?h? width 40 ? ns t wl(xin) xin input ?l? width 40 ? ns table 5.23 traio input symbol parameter standard unit min. max. t c(traio) traio input cycle time 300 ? ns t wh(traio) traio input ?h? width 120 ? ns t wl(traio) traio input ?l? width 120 ? ns xin input t wh(xin) t c(xin) t wl(xin) v cc = 3 v traio input v cc = 3 v t c(traio) t wl(traio) t wh(traio)
r8c/2e group, r8c/2f group 5. electrical characteristics rev.0.10 aug 01, 2007 page 38 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change figure 5.10 serial interface timing diagram when v cc = 3 v notes: 1. when selecting the digital filter by the inti input filter select bit, use an inti input high width of either (1/digital filter clock frequency 3) or the minimum value of standard, whichever is greater. 2. when selecting the digital filter by the inti input filter select bit, use an inti input low width of either (1/digital filter clock frequency 3) or the minimum value of standard, whichever is greater. figure 5.11 external interrupt inti input timing diagram when v cc = 3 v table 5.24 serial interface symbol parameter standard unit min. max. t c(ck) clk0 input cycle time 300 ? ns t w(ckh) clk0 input ?h? width 150 ? ns t w(ckl) clk0 input ?l? width 150 ? ns t d(c-q) txd0 output delay time ? 80 ns t h(c-q) txd0 hold time 0 ? ns t su(d-c) rxd0 input setup time 70 ? ns t h(c-d) rxd0 input hold time 90 ? ns table 5.25 external interrupt inti (i = 0, 1, 3) input symbol parameter standard unit min. max. t w(inh) inti input ?h? width 380 (1) ? ns t w(inl) inti input ?l? width 380 (2) ? ns t w(ckh) t c(ck) t w(ckl) t h(c-q) t h(c-d) t su(d-c) t d(c-q) clk0 txd0 rxd0 v cc = 3 v inti input t w(inl) t w(inh) v cc = 3 v i = 0, 1, 3
r8c/2e group, r8c/2f group package dimensions rev.0.10 aug 01, 2007 page 39 of 39 rej03b0222-0010 under development preliminary specification specications in this manual are tentative and subject to change package dimensions diagrams showing the latest package dimensions and mounti ng information are available in the ?packages? section of the renesas technology website. 2. 1. dimensions " * 1" and " * 2" do not include mold flash. note) dimension " * 3" does not include trim offset. y index mark * 3 f 32 25 24 17 16 9 8 1 * 1 * 2 x b p e h e e d h d z d z e detail f l 1 l a c a 2 a 1 previous code jeita package code renesas code plqp0032gb-a 32p6u-a mass[typ.] 0.2g p-lqfp32-7x7-0.80 1.0 0.125 0.35 0.7 0.7 0.20 0.20 0.145 0.09 0.42 0.37 0.32 max nom min dimension in millimeters symbol reference 7.1 7.0 6.9 d 7.1 7.0 6.9 e 1.4 a 2 9.2 9.0 8.8 9.2 9.0 8.8 1.7 a 0.2 0.1 0 0.7 0.5 0.3 l x 8 0 c 0.8 e 0.10 y h d h e a 1 b p b 1 c 1 z d z e l 1 terminal cross section b 1 c 1 bp c
a - 1 revision history r8c/2e group, r8c/2f group datasheet all trademarks and registered trademarks are the property of their respective owners. rev. date description page summary 0.10 aug 01, 2007 ? first edition issued r8c/2e group, r8c/ 2f group datasheet revision history
notes: 1. this document is provided for reference purposes only so that renesas customers may select the appropriate renesas product s for their use. renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of renesas or any third party with respect to the information in this document. 2. renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of t he use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. you should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. when exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. all information included in this document such as product data, diagrams, charts, programs, algorithms, and application ci rcuit examples, is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas products listed in this document, please confirm the latest product information with a renesas sales office. also, please pay regular and careful attentio n to additional and different information to be disclosed by renesas such as that disclosed through our website. (http://www.renesas.com ) 5. renesas has used reasonable care in compiling the information included in this document, but renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. when using or otherwise relying on the information in this document, you should evaluate the information in light of the t otal system before deciding about the applicability of such information to the intended application. renesas makes no representations, warranties or guaranties regarding th e suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this do cument or renesas products. 7. with the exception of products specified by renesas as suitable for automobile applications, renesas products are not desi gned, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of h uman injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion co ntrol, aerospace and aeronautics, nuclear power, or undersea communication transmission. if you are considering the use of our products for such purposes, please contact a r enesas sales office beforehand. renesas shall have no liability for damages arising out of the uses set forth above. 8. notwithstanding the preceding paragraph, you should not use renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to us e renesas products in any of the foregoing applications shall indemnify and hold harmless renesas technology corp., its affiliated companies and their officers, dir ectors, and employees against any and all damages arising out of such applications. 9. you should use the products described herein within the range specified by renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas sha ll have no liability for malfunctions or damages arising out of the use of renesas products beyond such specified ranges. 10. although renesas endeavors to improve the quality and reliability of its products, ic products have specific characteristic s such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. please be sure to implement safety measures to guard against the poss ibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas product, such as safety design for hardware and software includin g but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. among others, sinc e the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. in case renesas products listed in this document are detached from the products to which the renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. you should implement safety measures so that renesas products may not be easily detached from your products. renesas shall have no liability for damages arising out of such detachment. 12. this document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from r enesas. 13. please contact a renesas sales office if you have any questions regarding the information contained in this document, renes as semiconductor products, or if you have any other inquiries. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology (shanghai) co., ltd. unit 204, 205, aziacenter, no.1233 lujiazui ring rd, pudong district, shanghai, china 200120 tel: <86> (21) 5877-1818, fax: <86> (21) 6887-7898 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas technology korea co., ltd. kukje center bldg. 18th fl., 191, 2-ka, hangang-ro, yongsan-ku, seoul 140-702, korea tel: <82> (2) 796-3115, fax: <82> (2) 796-2145 renesas technology malaysia sdn. bhd unit 906, block b, menara amcorp, amcorp trade centre, no.18, jalan persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: <603> 7955-9390, fax: <603> 7955-9510 renesas sales offices ? 200 7. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .7.0

▲Up To Search▲

Price & Availability of R5F212F4DXXXFP

	To Download R5F212F4DXXXFP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .